Capabilities Overview
Capabilities Overview
OSI Laser Diode, Inc.‘s (LDI) comprehensive optoelectronic manufacturing facility utilizes our core competencies and capabilities. Our customers are provided with a diverse and extensive product offering where quality and reliability are of paramount importance.
LDI’s manufacturing capabilities include, but are not limited to:
- III-V Fabrication Facility
- Die Fabrication: Scribe and Cleave / Optical Facet Coating
- Device Fabrication: Die Mount and Wire Bond
- Device Characterization and Qualification Facilities
- Diverse Device Packaging Capabilities: TO Based, 14-pin DIL and Butterfly, High Heat Load Capability, Coaxial Fiber Pigtailed Devices, and Mini-DIL
- Laser Welded Single Mode Fiber Pigtails for Ultra Stable Coupling Efficiency
- Hermetic Packaging Standard
- Fiber Metallization Technology
- Broad Range of Test and Qualification Facilities including Telcordia GR-468-CORE and MIL-883
- Knowledgeable Engineering and Applications Teams
Subcontracting Work:
With over 44+ years of assembly experience, LDI’s established facility and responsive technical support team is key to delivering dependable, quality products. We are ready to address your requirements by working with your SLD, ELED or LASERS and placing them into the package of your choice.
Standards & Certifications
- ISO-9001:2008 Certified
- MIL-I-45208
- MIL-STD-883
- MIL-STD-750